Reviewers
Ghassan Al Regib, Georgia Institute of Technology
Loretta Anania, European Commission, DG information Society
Michael Ansorge, College of Engineering and Architecture of Fribourg (EIA-FR)
Vittorio Baroncini, Fondazione Ugo Bordoni
Alan C. Bovik, The University of Texas
Madhukar Budagavi, Texas Instruments Inc.
Philip Corriveau, Intel Corporation
Pamela Cosman, University of California, San Diego
Gokce Dane, Qualcomm
Sujit Dey, UCSD/Ortiva Wireless
Frederic Dufaux, Ecole Polytechnique Federale de Lausanne (EPFL)
Touradj Ebrahimi, Ecole Polytechnique Fédérale de Lausanne (EPFL)
Khaled El-Maleh, Qualcomm
Zheng Fang , Qualcomm Inc.
Joyce Farrell, Stanford Center for Image Systems Engineering
Jerry D. Gibson, University of California, Santa Barbara
Hans W. Gierlich, HEAD acoustics GmbH
Alan Hanjalic, Delft University of Technology
Hidenobu Harasaki, NEC Corporation
Shay Har-Noy, University of California, San Diego
Yuukou Horita, University of Toyama
Jeff Huang, Qualcomm
Hau Hwang, Qualcomm
Ebroul Izquierdo, Queen Mary, University of London
Lina Karam, Arizona State University
Moinul Khan, Qualcomm
Thomas Kim, Qualcomm
Bastiaan Kleijn, KTH - Royal Institute of Technology
Aleksandra Krstic, Qualcomm
Reginald Lagendijk, Delft University of Technology
Patrick Le Callet, Université de Nantes- IRCCyN
Weisi Lin, Assoc Professor
Xiaoan Lu, Thomson, Inc.
Jiancong Luo, Thomson, Inc.
Zhan Ma, Polytechnic Institute of New York University
Alessandro Neri, University of Roma TRE
Truong Nguyen, UCSD
Seyfullah Halit Oguz, Qualcomm
Fernando Pereira, Instituto Superior Técnico - Instituto de Telecomunicações
Andrew Perkis, Norwegian University of Science and Technology - NTNU
Alexander Raake, Deutsche Telekom Laboratories, TU Berlin
Vikas Ramachandra , University of California, San Diego
Amy Reibman, AT&T Labs - Research
Ulrich Reiter, Norwegian University of Science and Technology
Sang Ryu, Qualcomm
Bulent Sankur, Bogazici University
Daniel Sinder, Qualcomm
Nitin Suresh, VQLink Inc.
Maric Svetislav, Qualcomm
Stephen Voran, Institute for Telecommunication Sciences
Haohong Wang, Marvell Semiconductors
Zhou Wang, University of Waterloo
Stefan Winkler, Symmetricom
Buyue Zhang, Texas Instruments